| Application | |
| CPU Socket | LGA1700 |
| CPU | Recommend for Intel Alder Lake S Processor |
| Solution | Passive Copper Heatsink for 1U Server |
| Technical Data | |
| Overall dimension | 90 x 90 x 27 mm |
| Weight | 533.7g |
| Heat Sink | |
| Material | Copper Heat Sink with Skiving Fíns |
| Fan | |
| Thermal grease | Pre-Printed with SHIN-ETSU 7762 |
Pre vstup na túto webovú stránku prosím potvrďte, že spĺňate vekovú hranicu 18 rokov
